End of Life Notices
Product obsolescence is a fact of semiconductor life that can be difficult to navigate. SemiDice can assist you in several ways. Not only do we notify customers when parts purchased from us are going obsolete, but we can also go in for last time buys and secure product from the manufacturers then schedule deliveries according to our customers needs. As well, we gladly assist on finding alternate design-ins with full factory support to finding suitable replacements for most applications.
- Disclaimer: While we strive to provide a thorough and complete list, this may not represent the entire list of bare die products going obsolete. We encourage you to contact a SemiDice sales representative for further EOL information.
- (11/27/19) EOL of SG Parts
- (2018) EOL of Various 2N2857/UB
- (02/12/18) EOL of Le89010QVC, Le89900AMC, and Le89316QVC Products
- (08/10/17) EOL of RF Power Transistor Products Offered by Microsemi Discrete Product Group (DPG)
- (01/2018) EOL of Various Non-Hermetic Zener Diodes
- (06/01/17) EOL of 1N4614C and 1N4714D /UR
- (02/06/17) Manufacturing Site Change
Product Change Notices
The following PCN alerts are the current notifications we have received from our semiconductor partners.
- (01/07/16) Qualification Report for P5C6AAB
- (03/19/15) 5" Wafer Fabrication to 6" & 8" Wafer Fabrication
- (03/11/15) Correction of IDSS Parameter
- (06/16/14) 5" & 6" Wafer Manufacturing to 6" & 8" Wafer Manufacturing
- (04/18/13) Fab Location Change from ASMC 6" Fab to Mountain Top 8" Fab
- (11/29/12) Products Removed from Salt Lake 8" Line, Continued on Salt Lake 6" Line
- (06/24/19) Manufacturing Capacity Transfer High Voltage MOSFET Die On Film and Die On Wafer
- (05-25-18) Additional Commercial Power MOSFET Wafer Fabrication Capacity
- (08/18/15) Cage Code Change of Vishay Israel Ltd. Dimona Plant
- (12/01/14) 6" Qualification for Schottky Bare Die Products
- (11/21/14) Change in Wafer Foundry for 3 High-Voltage MOSFET
- (11/20/14) PLT Low TCR Thin Film Resistor, Surface Mount Chip
- (04/14/14) 6" Qualification for Schottky Bare Die Products
- (03/07/14) Additional Wafer Fabrication Capacity
- (02/28/24) Adding PCM Electrical Structures
- (03/21/22) Increased Ti Thickness
- (09/21/20) Wafer Diameter Change from 100mm to 150mm Bare Die MOSFETs
- (09/15/20) New Location Test, Die, and Inspection for All Bare Die Power Products
- (08/30/20) Silicon Carbide (SiC) 900V MOSFETs Manufactured on 150mm Diameter Wafers
- (08/22/19) Wafer Diameter Changes from 100mm to 150mm for More Bare Die MOSFETs
- (08/17/19) Wafer Diameter Changes from 100mm to 150mm for Bare Die MOSFETs
- (01/25/19) REVISION Qualification of Expanded 150mm Wafer Manufacturing Facility
- (08/10/18) Qualification of Expanded 150mm Wafer Manufacturing Facility
- (08/09/18) Change of Back Metal Over-Layer Stack for CPWR Series SiC Schottky Die
- (03/12/18) Change of Delivery Tape & Ring for All MOSFET Bare Die Products
- (02/01/18) Change of Backside Metal Anneal Tool Platform
- (04/28/17) Change of Wafer Diameter from 100mm to 150mm for Schottky Diode Products