Wafer Processing
Wide portfolio of expertise, including: wafer mapping, inking and sawing of wafers up to 12"
More infoWafer Probe
SemiDice can re-probe a wafer to tighter limits to select die that meet a customer’s specific requirements
More infoLot Acceptance Testing
SemiDice offers Class H, K and T Lot Acceptance Testing to our customers through our Hi Rel Division
More infoLong Term Die Storage
SemiDice is the toolbox for design engineers to gather information for newly developed die part numbers and samples
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